公司可提供4OZ—14OZ(名義厚度140 μ m-500 μ m)的甚低輪廓度高溫延展性超厚電解銅箔（VLP-THE-HF）,產品為片狀，最大規格1295mm*1295mm.甚低輪廓高溫延展性超厚電解銅箔不但具胡等軸細晶、低輪廓、高強度、高延伸率的優良物理性能，同時具有高剝離強度、無銅粉轉移、圓形清晰的PCB制造性能，適用于電力、汽車等大功率電路用“大電流PCB”的制造。

      We provide the 4oz/ft² to 14oz/ft²(nominal thickness 140 μm to 500μ m)very-low-profile,high temperature elongation,and heavy (VLP-THE-HF)ED copper foils,they are sheet products; and the max dimension is 1295╳1295mm.They have the perfect physical characteristics of the fine and uniform crystal structure ,the low profile,the high intensity,and high elongation;and they also have the PCB manufacturing performances of the high peel strength,no copper powder movement,the clear figure.They can be used in production of the extreme PCBs which are used in the extremer circuits of the electric power and the motor vehicles.

超厚電解銅箔特性

  注：1、剝離強度為標準FR-4板測試值。（140℃/5張7628PP）

      2、品質保證期限自收貨日起90天。

Note:1、The peel strength is the test value of the standard FR-4 plate.( 140℃ 5 pieces of the 7628PP)

        2、The duration of the quality guarantee period is 90 days from the receiving date.